EQUIPMENT ENGINEER/SENIOR (DIE ATTACH)

Micron Memory Malaysia Sdn Bhd
Permanent
Application ends: January 1, 2023
Apply Now

Job Description

Responsibilities:

  • Implement Preventive/Predictive maintenance program
  • Develop equipment maintenance specification
  • Monitor equipment performance key indicators and responsible to meet expectation
  • Provide necessary production support
  • Establish spare inventory system for key equipment
  • Monitor spare cost and drive down liabilities of spare inventories
  • Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
  • Identify the key cost drivers and work on cost reduction programs
  • Define, develop and maintain equipment capabilities, strategy and roadmap
  • Maintaining a matrix on equipment capabilities and constraints
  • Work with equipment suppliers to develop new material / capabilities
  • Regularly conduct equipment benchmarking exercise
  • Work with equipment suppliers to develop new capability
  • Work with Package Development team to establish production capabilities for new products

Qualification & Requirement:

  • Master / Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering
  • At least 4 years of experience in semiconductor industry with knowledge in Die Attach, Wire Bond, Plasma Cleaning will be added advantages.
  • Excellent interpersonal, communication and leadership skill with an extremely positive attitude towards working as a team.
  • Problem solving analytical skill
  • Self-motivated, possess initiative and ability to work independently
  • Team player with good communication and interpersonal skills

 

 

Application Link:

https://micron.wd;Die-Attach-_JR

Related Jobs